Brief: China Beidahuang Industry Group Holdings Issues Bonds Due 2037
Sept 24 (Reuters) - China Beidahuang Industry Group Holdings
Ltd 0039.HK :
* ISSUED HK$20 MILLION PRINCIPAL AMOUNT OF 0.02 PER CENT
BONDS DUE
2037
Source text for Eikon: ID:nHKS1jmzzv
Further company coverage: 0039.HK
((Reuters.Briefs@thomsonreuters.com;))
Recent news on China Beidahuang Industry group
See all newsBrief: China Beidahuang Industry Says Trading Of Shares On HKEX Halted
Brief: China Beidahuang Industry Says Individual Commenced Action At HK High Court
Brief: China Beidahuang Industry Says Liu Xiaopeng Reappointed As Executive Director
Brief: China Beidahuang Industry Says Unit Enters Entrusted Processing Agreement
Brief: China Beidahuang Industry Says Hunan Magic Foods Technology Entered Into Supply Contract