Brief: WT Microelectronics Scraps Bond Issue Due To Changes In Capital Market
31/03/2023 11:58
March 31 (Reuters) - WT Microelectronics Co Ltd
3036.TW :
* SAYS IT SCRAPS PLAN FOR CONVERTIBLE BOND ISSUE DUE TO
CHANGES IN
CAPITAL MARKET CONDITIONS
Source text for Eikon: ID:nMOP78LbKG
Further company coverage: 3036.TW
(Reporting by Hong Kong newsroom)
((meg.shen@thomsonreuters.com; 852-39525805;))
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