Brief: ACM Research Enters Fan-Out Panel Level Packaging Market With Introduction Of Ultra C vac-p Flux Cleaning Tool For Chiplets
29/07/2024 21:24
July 29 (Reuters) - ACM Research Inc ACMR.O :
* ACM RESEARCH ENTERS FAN-OUT PANEL LEVEL PACKAGING MARKET
WITH
INTRODUCTION OF ULTRA C VAC-P FLUX CLEANING TOOL FOR CHIPLETS
* ACM RESEARCH INC - RECEIVED PURCHASE ORDER FROM A MAJOR
CHINA
SEMICONDUCTOR MANUFACTURER WHICH HAS BEEN SHIPPED TO CUSTOMER'S
FACILITY IN JULY
Source text for Eikon: ID:nGNX3ctHMS
Further company coverage: ACMR.O
((Reuters.Briefs@thomsonreuters.com;))
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