Brief: Amkor Tech Breaks Ground On New Semiconductor Advanced Packaging In Arizona
06/10/2025 23:03
Oct 6 (Reuters) - Amkor Technology Inc AMKR.O: AMKOR TECHNOLOGY BREAKS GROUND ON NEW SEMICONDUCTOR ADVANCED PACKAGING AND TEST CAMPUS IN ARIZONA; EXPANDS INVESTMENT TO $7 BILLION AMKOR TECHNOLOGY INC - FIRST FACILITY COMPLETION EXPECTED MID-2027, PRODUCTION IN 2028 AMKOR TECHNOLOGY INC - INVESTMENT SUPPORTED BY CHIPS FOR AMERICA PROGRAM AND TAX CREDITS, STATE AND LOCAL GOVERNMENTS AMKOR TECHNOLOGY INC: EXPANDED INVESTMENT INCLUDES ADDITIONAL CLEANROOM SPACE AND A SECOND GREENFIELD PACKAGING AND TEST FACILITY Source text: ID:nBw69D8dya Further company coverage: AMKR.O ((Reuters.Briefs@thomsonreuters.com;))