US finalizes up to $407 million award to Amkor for Arizona chip packaging plant
20/12/2024 22:00
WASHINGTON ,Dec 20 (Reuters) - The U.S. Commerce
Department said on Friday it finalized an award to Amkor
Technology AMKR.O of up to $407 million to help fund the
company's planned $2 billion advanced semiconductor packaging
facility in Arizona.
The plant is set to be the largest of its kind in the U.S.
and when fully operational will package and test millions of
chips for autonomous vehicles, 5G/6G and data centers. Apple
AAPL.O will be its first and largest customer with the chips
produced at a nearby Taiwanese chipmaker TSMC 2330.TW
facility.
(Reporting by David Shepardson)
((David.Shepardson@thomsonreuters.com; 2028988324;))