Brief: ASE Technology To Raise Up To T$20 Billion Via Unsecured Bonds
09/04/2026 08:52
TAIPEI, April 9 (Reuters) - ASE Technology Holding Co Ltd 3711.TW: TO RAISE UP TO T$20 BILLION ($628.9 MLN) VIA UNSECURED BONDS Source text: ID:nMOP2MbwVN Further company coverage: 3711.TW (Reporting by Faith Hung) ((faith.hung@thomsonreuters.com;))
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