Brief: ASE Technology To Raise Up To T$20 Billion Via Unsecured Bonds
09/04/2026 08:52
TAIPEI, April 9 (Reuters) - ASE Technology Holding Co Ltd 3711.TW: TO RAISE UP TO T$20 BILLION ($628.9 MLN) VIA UNSECURED BONDS Source text: ID:nMOP2MbwVN Further company coverage: 3711.TW (Reporting by Faith Hung) ((faith.hung@thomsonreuters.com;))
Recent news on ASE Technology Holding Co
See all newsBrief: ASE Technology Unit Makes Multiple Purchases Of Machinery Equipment For Total Of T$8.84 Bln
Brief: ASE Technology's Unit Obtains Engineering Project Worth T$547.3 Mln
Brief: ASE Technology's Unit Acquires Machinery Equipment For T$1.01 Bln
Brief: ASE Technology Holding Unit Acquires Machinery Equipment For T$300.2 Mln
Brief: ASE Technology Holding Unit Acquires Engineered Machinery For T$550.35 Million