Jan 26 (Reuters) - BizLink Holding Inc 3665.TW
* Says it will issue second series overseas unsecured
convertible
corporate bonds worth $100 million
* Par value and issue price of $250,000 for the bonds
* Maturity date on Feb. 1, 2023 and issue date on Feb. 1,
2018
* Yuanta Securities (Hong Kong) Company Limited will act as
the
main underwriter
* The bonds will be used for loan repayment and overseas
materials
purchase
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