Brief: Bondada Engineering Approves Issuance And Allotment Of Warrants Via Preferential Issue On A Private Placement Basis
05/06/2024 15:19
June 5 (Reuters) - Bondada Engineering Ltd BOND.BO :
* BONDADA ENGINEERING - APPROVED ISSUANCE AND ALLOTMENT OF
WARRANTS VIA PREFERENTIAL ISSUE ON A PRIVATE PLACEMENT BASIS
Source text for Eikon: ID:nBSEdvg7X
Further company coverage: BOND.BO
((Reuters.Briefs@thomsonreuters.com;))
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