Brief: Chengdu Expressway Says Approved Proposed Issue Of Corporate Bonds
July 10 (Reuters) - Chengdu Expressway 1785.HK :
* APPROVED PROPOSED ISSUE OF CORPORATE BONDS WITH AGGREGATE
PRINCIPAL AMOUNT OF NOT MORE THAN RMB2 BILLION
Further company coverage: 1785.HK
((Reuters.Briefs@thomsonreuters.com;))
Recent news on Chengdu Expressway
See all newsBrief: Chengdu Expressway Co Says Pan Xin Resigns As Executive Director
Brief: Chengdu Expressway Announces Subscription Of Limited Partner Interests In Fund
Brief: Chengdu Expressway Says Does Not Recommend Payment Of Interim Dividend
China's Chengdu Expressway H1 revenue falls on lower traffic
Brief: Chengdu Expressway Says Yang Tan Resigns As Chairman