Brief: Hong Kong Aerospace Technology Says Placing Of Bonds
11/08/2022 15:41
Aug 11 (Reuters) - Hong Kong Aerospace Technology 1725.HK :
* PLACING OF BONDS
* VENTURE SMART ASIA TO PROCURE PLACEES TO SUBSCRIBE FOR
BONDS UP
TO PRINCIPAL AMOUNT OF HK$300 MILLION
Source text for Eikon: ID:nHKSc4qdkt
Further company coverage: 1725.HK
((Reuters.Briefs@thomsonreuters.com;))
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