Brief: CLPS Subsidiary Signs MoU With Technological And Higher Education Institute Of Hong Kong
26/08/2020 13:42
Aug 26 (Reuters) - CLPS Inc CLPS.O :
* CLPS INC - HONG KONG SUBSIDIARY SIGNED A MOU WITH
TECHNOLOGICAL
AND HIGHER EDUCATION INSTITUTE OF HONG KONG
Source text for Eikon: ID:nPn7xZyQQa
Further company coverage: CLPS.O
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