Brief: Coolpad Group Updates On Lawsuit Regarding Financing Loan Contract Dispute
Jan 16 (Reuters) - Coolpad Group Ltd 2369.HK :
* RECEIVED CIVIL VERDICT FROM PEOPLE'S COURT OF FUTIAN
DISTRICT,
SHENZHEN CITY CONCERNING FINANCING LOAN CONTRACT DISPUTE
* COURT MADE VERDICT TO APPROVE APPLICATION BY SHANGHAI
PUDONG
DEVELOPMENT BANK CO., LTD., SHENZHEN BRANCH TO WITHDRAW CASE
Source text for Eikon: urn:newsml:reuters.com:*:nHKS2g85QR
Further company coverage: 2369.HK
(bangalore.newsroom@thomsonreuters.com)
Recent news on Coolpad
See all newsBrief: Coolpad Group Posts FY Revenue HKD 273.14 Million
Brief: Coolpad Group Announces Investigation Against An Independent Non-Executive Director
Brief: Coolpad Group Expects FY2025 Loss Attributable At HK$105 Million-HK$125 Million
Brief: Coolpad Group's Unit Acquires Total Of 39,000 Strategy Inc Shares For Consideration Of $4.98 MLN
Brief: Coolpad Resolved To Conduct Further Repurchase Of Shares On Open Market