Brief: Da-li Development to issue 2018 1st tranche corporate bonds worth T$1 bln

Da-Li Development

16/03/2018 11:34

March 16(Reuters) - Da-li Development Co Ltd  6177.TW  :
    
    * Says it plans to issue 2018 1st tranche corporate bonds
worth
T$1 billion 

      
    
    Source text in Chinese: https://goo.gl/ZQ54JR
    Further company coverage:  6177.TW 

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