RCS - EnSilica PLC - Announcement by SIAE Microelettronica re. Contract

EnSilicaAnnouncement

26/09/2024 13:45

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RNS Number : 8554F  EnSilica PLC  26 September 2024

Reach announcement*

 

26 September 2024

 

EnSilica plc

("EnSilica", the "Company" or the "Group")

 

Announcement by SIAE Microelettronica regarding Contract Award

 

EnSilica, a leading chip maker of mixed signal ASICs (Application Specific
Integrated Circuits), notes the following press announcement released today by
SIAE Microelettronica regarding the contract announced by EnSilica on 2
September 2024:

 

"SIAE MICROELETTRONICA (https://www.siaemic.com/index.php) , a leading
provider of innovative microwave radio and wireless network solutions, has
selected EnSilica, a leading turnkey supplier of mixed signal ASICs and SoCs,
to assist the design of Application-Specific Integrated Circuits (ASICs) for
its next-generation telecommunication infrastructure products.

 

The commercial relationship, contracted to last ten years, will include the
integration of SIAE MICROELETTRONICA design into custom-made ASICs. This joint
development will enable the Italian company to enhance the portfolio with
remarkable technological evolutions and new products in line with the targets
of its IPCEI EMISPHERE program. EnSilica's extensive expertise in developing
high-performance radio frequency and complex digital systems and its robust
and well-documented supply chain management capabilities were pivotal in
securing the ASIC contract.

 

SIAE MICROELETTRONICA, a global leader in wireless communication technology
with a complete range of microwave and millimeter wave radio solutions, is
improving the European value chain with in-house development of innovative
modem chips, microwave components to enable the next generation of radio
products for the mobile communications industry.

 

"We are delighted that SIAE MICROELETTRONICA selected our technical and
commercial offering. As the demand for even higher data rates and the push for
more power-efficient systems increases at pace, ASICs are becoming essential
for the next generation of terrestrial and satellite telecommunications
equipment" commented Paul Morris, VP RF and Communications Business Unit at
EnSilica "And we look forward to working closely with their team to turn this
project into a commercial success for both parties."

 

"Our partnership is a strategic move that leverages EnSilica's expertise in
ASIC design and SIAE's deep understanding of the microwave market" commented
Claudio Passera, SIAE MICROELETTRONICA Group R&D Director "and this unique
combination positions us to develop innovative platforms and products that
address the critical needs of emerging applications beyond 5G. By combining
our strengths, we're gaining a significant competitive advantage and
delivering customer-centric solutions that will solidify our leadership in the
microwave radio and wireless network solutions space."

 

EnSilica brings its RF and communications knowledge along with expertise in
developing complex mixed signal ASICs. Reducing development risk is key and
EnSilica demonstrated how these risks can be mitigated giving SIAE
MICROELETTRONICA confidence in the selection of EnSilica. This comes alongside
the usual benefit of ASICs in terms of saving power, cost and size whilst
protecting smart IP deep within the ASIC.

 

 

This partnership between EnSilica and SIAE MICROELETTRONICA is the base of a
successful project output, representing a very critical part of the overall
IPCEI EMISPHERE project, which is a key element for SIAE MICROELETTRONICA's
plan for growth of technological solutions and expansion into new markets",
said Stefano Poli, SIAE MICROELETTRONICA Group Managing Director.

 

Ian Lankshear, Chief Executive Officer of EnSilica, added: "This significant
contract marks the beginning of what we hope will be a long-term and mutually
beneficial partnership with a key telecoms client. Our ability to both develop
and deliver highly complex solutions continues to drive some of the world's
leading equipment manufacturers to select EnSilica as the partner of choice."

 

About SIAE MICROELETTRONICA

 

SIAE MICROELETTRONICA is an Italian company leader in wireless communication
technology, offering to telecom operators advanced solutions for microwave and
millimeter-wave backhaul, services and design. SIAE MICROELETTRONICA designs
and produces its own RF components end-to-end from silicon up to system level
liaising over in-house RF laboratories, clean-room facilities and complete
product assembly. SIAE MICROELETTRONICA is one of the companies selected as
recipients of the IPCEI funds (Important Project of Common European Interest)
sponsored by European Community to support research, innovation and the
industrial diffusion of microelectronics and communication technologies. The
company is headquartered near Milano, Italy and cover the global market with
more than 20 operating affiliates worldwide."

 

For further information please contact:

 

 EnSilica plc                                                        via Vigo Consulting

 Ian Lankshear, Chief Executive Officer                              +44 (0)20 7390 0233

 Kristoff Rademan, Chief Financial Officer

 www.ensilica.com (http://www.ensilica.com/)

 Allenby Capital Limited, Nominated Adviser & Joint Broker           +44 (0)20 3328 5656

 Jeremy Porter / Vivek Bhardwaj (Corporate Finance)                  info@allenbycapital.com (mailto:info@allenbycapital.com)

 Joscelin Pinnington / Tony Quirke (Sales & Corporate Broking)

 Singer Capital Markets, Joint Broker

 Rick Thompson / Asha Chotai                                         +44 (0)20 7496 3000

 Vigo Consulting (Investor & Financial Public Relations)             +44 (0)20 7390 0233 ensilica@vigoconsulting.com

                                                                   (mailto:visum@vigoconsulting.com)
 Jeremy Garcia / Kendall Hill

 

About EnSilica

 

EnSilica is a leading fabless design house focused on custom ASIC design and
supply for OEMs and system houses, as well as IC design services for companies
with their own design teams. The company has world-class expertise in
supplying custom RF, mmWave, mixed signal and digital ICs to its international
customers in the automotive, industrial, healthcare and communications
markets. The company also offers a broad portfolio of core IP covering
cryptography, radar, and communications systems. EnSilica has a track record
in delivering high quality solutions to demanding industry standards. The
company is headquartered near Oxford, UK and has design centres across the UK
and in Bangalore, India and Porto Alegre, Brazil.

 

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