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RNS Number : 8327B EnSilica PLC 24 March 2025
The information contained within this announcement was deemed by the Company
to constitute inside information as stipulated under the UK Market Abuse
Regulation.
24 March 2025
EnSilica plc
("EnSilica", the "Company" or the "Group")
EnSilica Agrees a Multimillion Pound Design and Manufacturing Services
Contract
Increased demand leads to second design centre in Brazil
EnSilica plc (AIM:ENSI), a leading chip maker of mixed signal ASICs
("Application Specific Integrated Circuits"), is pleased to announce that it
has been awarded a multimillion-pound design and manufacturing services
contract by a well-funded pioneering optical computing systems company (the
"Contract").
The Contract includes substantial design services engagement and additional
manufacturing services. Following the completion of an initial study phase,
activity will now increase significantly, with revenues contributing to
EnSilica's current and the following two financial years.
This addition to EnSilica's offerings stems from strengthened relationships
with key wafer foundry and semiconductor supply chain partners. This now
allows EnSilica to provide wafers, packages, and tested devices along with
design services. This model, successfully executed by several Asian companies
including Socionext, Alchip, and Global Uni Chip (GUC), is now being leveraged
by the Company to meet the growing demand for a resilient European-based
supply chain.
Finally, and due to increased demand, EnSilica has opened a second design
centre in Campinas, São Paulo State, Brazil. This location, with its strong
semiconductor ecosystem, has enabled the rapid growth of EnSilica's existing
engineering team in the region.
Ian Lankshear, CEO of EnSilica, commented:
"We are pleased to secure this sizable contract with a pioneering optical
computing systems company. This agreement not only underscores our
capabilities in delivering comprehensive design and manufacturing services but
also highlights the growing demand for European-based supply chains.
Our strengthened relationships with key wafer foundry and semiconductor supply
chain partners enable us to provide high-quality wafers, packages, and
completed tested devices.
We are also delighted to be opening our second design centre in Brazil, which
further underscores our strategic ambitions to expand our global footprint in
order to meet the increasing demand for our services."
For further information please contact:
EnSilica plc via Vigo Consulting
Ian Lankshear, Chief Executive Officer +44 (0)20 7390 0233
Kristoff Rademan, Chief Financial Officer
www.ensilica.com (http://www.ensilica.com/)
Allenby Capital Limited, Nominated Adviser & Joint Broker +44 (0)20 3328 5656
Jeremy Porter / Vivek Bhardwaj (Corporate Finance) info@allenbycapital.com (mailto:info@allenbycapital.com)
Joscelin Pinnington / Tony Quirke (Sales & Corporate Broking)
Singer Capital Markets, Joint Broker
Rick Thompson / Asha Chotai +44 (0)20 7496 3000
Vigo Consulting (Investor & Financial Public Relations) +44 (0)20 7390 0233 ensilica@vigoconsulting.com
(mailto:visum@vigoconsulting.com)
Jeremy Garcia / Kendall Hill / Anna Stacey
The person responsible for arranging release of this announcement on behalf of
the Company is Ian Lankshear, Chief Executive Officer.
About EnSilica plc
EnSilica is a leading fabless design house focused on custom ASIC design and
supply for OEMs and system houses, as well as IC design services for companies
with their own design teams. The company has world-class expertise in
supplying custom RF, mmWave, mixed signal and digital ICs to its international
customers in the automotive, industrial, healthcare and communications
markets. EnSilica has a track record in delivering high quality solutions to
demanding industry standards. The company is headquartered near Oxford,
UK and has design centres across the UK and in Bangalore,
India and Porto Alegre and Campinas, Brazil.
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