REG - EnSilica PLC - EnSilica joins TSMC Design Center Alliance

EnSilicaAnnouncement

19/09/2024 07:00

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RNS Number : 7590E  EnSilica PLC  19 September 2024

19 September 2024

 

EnSilica plc

("EnSilica", the "Company" or the "Group")

 

EnSilica joins TSMC Design Center Alliance

 

EnSilica, a leading chip maker of mixed signal ASICs (Application Specific
Integrated Circuits), is pleased to announce that it has joined the Design
Center Alliance
(https://www.tsmc.com/english/dedicatedFoundry/design-center-alliance) ("DCA")
of the Taiwan Semiconductor Manufacturing Company's ("TSMC") Open Innovation
Platform® ("OIP").

 

TSMC's DCA programme focuses on chip implementation service and system level
design solution enablement to lower the design barriers for customers adopting
TSMC technology.

 

EnSilica's partnership with TSMC through the DCA programme strengthens
EnSilica's value in enabling the next-generation of system-on-chips (SoCs),
ranging from mixed signal devices for industrial and automotive applications
to communications and edge artificial intelligence (AI) chips using TSMC's
most advanced process technologies.

 

The TSMC Open Innovation Platform
(https://www.tsmc.com/english/dedicatedFoundry/oip) initiative is the
industry's most comprehensive design ecosystem that includes all critical
integrated circuit implementation areas to reduce design barriers and improve
first-time silicon success. The OIP actively promotes the speedy
implementation of innovation amongst the semiconductor design community,
enabling semiconductor designers to harness TSMC's leading process and
3DFabric technologies to reach an entirely new level of performance and power
efficiency for the next-generation artificial intelligence (AI),
high-performance computing (HPC), and mobile applications.

 

Ian Lankshear, Chief Executive Officer of EnSilica, commented:

 

"Joining the TSMC DCA programme marks a significant achievement for EnSilica.
Our deep expertise in mixed signal and RF design, combined with TSMC's
advanced technology, positions us to deliver unparalleled solutions to our
mutual customers."

 

Dan Kochpatcharin, Head of Ecosystem and Alliance Management Division at TSMC,
commented:

 

"We are pleased to welcome EnSilica to the TSMC OIP Design Center Alliance,
providing value-added service and solutions in enabling semiconductor design
using TSMC's advanced process technologies. TSMC is committed to collaborating
with our OIP ecosystem partners, including EnSilica, to empower customers in
achieving their design goals and quickly bringing their innovation to market."

 

 

For further information please contact:

 

 EnSilica plc                                                        via Vigo Consulting

 Ian Lankshear, Chief Executive Officer                              +44 (0)20 7390 0233

 Kristoff Rademan, Chief Financial Officer

 www.ensilica.com (http://www.ensilica.com)

 Allenby Capital Limited, Nominated Adviser & Joint Broker           +44 (0)20 3328 5656

 Jeremy Porter / Vivek Bhardwaj (Corporate Finance)                  info@allenbycapital.com (mailto:info@allenbycapital.com)

 Joscelin Pinnington / Tony Quirke (Sales & Corporate Broking)

 Singer Capital Markets, Joint Broker

 Rick Thompson / Asha Chotai                                         +44 (0)20 7496 3000

 Vigo Consulting (Investor & Financial Public Relations)             +44 (0)20 7390 0233 ensilica@vigoconsulting.com

                                                                   (mailto:visum@vigoconsulting.com)
 Jeremy Garcia / Kendall Hill

 

About EnSilica

 

EnSilica is a leading fabless design house focused on custom ASIC design and
supply for OEMs and system houses, as well as IC design services for companies
with their own design teams. The company has world-class expertise in
supplying custom RF, mmWave, mixed signal and digital ICs to its international
customers in the automotive, industrial, healthcare and communications
markets. The company also offers a broad portfolio of core IP covering
cryptography, radar, and communications systems. EnSilica has a track record
in delivering high quality solutions to demanding industry standards. The
company is headquartered near Oxford, UK and has design centres across the UK
and in Bangalore, India and Porto Alegre, Brazil.

 

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