REG - EnSilica PLC - EUR2.5m Satellite Broadband Chip Contract Secured

EnSilicaAnnouncement

30/08/2023 07:00

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RNS Number : 7203K  EnSilica PLC  30 August 2023

 

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30 August 2023

 

EnSilica plc

("EnSilica", the "Company" or the "Group")

 

New lead customer secured for EnSilica's Satellite Broadband Chip worth €2.5
million

 

EnSilica (AIM: ENSI), a leading chip maker of mixed signal ASICs (Application
Specific Integrated Circuits), is pleased to announce that it has secured a
contract worth €2.5m with a lead customer for EnSilica's proprietary
satellite broadband chip (the "Contract").  The Contract provides the
customer with early access to the satellite broadband chip and an order for
EnSilica for the first 50,000 chips.  The Customer is a vendor of user
terminals for SatCom on-the-Move (SOTM) applications, using EnSilica's chips
to address the next generation of mass market satellite broadband user
terminals.

 

Funding of €5m for the development phase of the satellite broadband chip was
announced by EnSilica on 17 February 2023, which was provided under the
framework of the European Space Agency's Advanced Research in
Telecommunications Systems Core Competitiveness programme, with the support of
the UK Space Agency.

 

This chip will enable the next generation of low-cost, low-power satellite
broadband user terminals. This type of component is a key enabler for user
terminals operating with low earth orbit satellite systems. User terminals
track the relative movement of the satellites, allowing users to access
high-capacity connectivity in a very wide range of use cases, including
automotive, maritime and aerospace connectivity, as well as connectivity for
rural households.

 

Ian Lankshear, Chief Executive Officer of EnSilica plc, commented:

 

"With the satellite broadband communications market a key growth driver for
our business, we are delighted to have a lead customer adopting our innovative
semiconductor solution for their next generation of satellite broadband user
terminals.

 

Given the high number of chips per antenna, and the millions of users that
could adopt these services, the potential growth within this market could be
significant for our business across the medium term."

 

 

For further information please contact:

 

 EnSilica plc                                                        Via Vigo Consulting

 Ian Lankshear, Chief Executive Officer                              +44 (0)20 7390 0233

 www.ensilica.com (http://www.ensilica.com/)

 Allenby Capital Limited, Nominated Adviser & Broker                  +44 (0)20 3328 5656

 Jeremy Porter / Vivek Bhardwaj (Corporate Finance)                  info@allenbycapital.com

 Joscelin Pinnington / Tony Quirke (Sales & Corporate Broking)

 Vigo Consulting (Investor & Financial Public Relations)             +44 (0)20 7390 0233 ensilica@vigoconsulting.com

                                                                   (mailto:visum@vigoconsulting.com)
 Jeremy Garcia / Kate Kilgallen

 

About EnSilica

 

EnSilica is a leading fabless design house focused on custom ASIC design and
supply for OEMs and system houses, as well as IC design services for companies
with their own design teams. The Company has world-class expertise in
supplying custom RF, mmWave, mixed signal and digital ICs to its international
customers in the automotive, industrial, healthcare and communications
markets. The Company also offers a broad portfolio of core IP covering
cryptography, radar, and communications systems. EnSilica has a track record
of delivering high quality solutions to demanding industry standards. The
Company is headquartered near Oxford, UK and has design centres across the
UK, in Bangalore, India and  in Port Alegre, Brazil.

 

 

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