REG - EnSilica PLC - MoU with European Satellite Operator

EnSilicaAnnouncement

10/04/2025 07:00

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RNS Number : 3788E  EnSilica PLC  10 April 2025

The information contained within this announcement was deemed by the Company
to constitute inside information as stipulated under the UK Market Abuse
Regulation.

 

10 April 2025

 

 EnSilica plc 

("EnSilica", the "Company" or the "Group") 

 

EnSilica Signs MoU with European Satellite Operator

 

Includes feasibility study for a planned satellite payload ASIC

 

EnSilica plc (AIM:ENSI), a leading chip maker of mixed signal ASICs
(Application Specific Integrated Circuits), is pleased to announce it has
signed a binding Memorandum of Understanding ("MoU") with a major European
satellite operator to support its chipset requirements. The MoU includes a
contract for the feasibility study for a high-value satellite payload ASIC.

 

The feasibility study contract will commence this month, with non-recurring
engineering revenues falling into EnSilica's current and next financial years.
A positive outcome in the feasibility study is likely to lead to the
significant development of an ASIC used in the payload of a communications
satellite.

 

EnSilica has a specialist business unit focused on radio frequency (RF) and
communications, with key differentiated technology and experience for chips
used for satellite payloads, user terminals, modems and receivers for
positioning and timing (PNT). The Company expects increased market activity
across these areas as the technologies, critical for defence and government
applications, are growing in importance given the ongoing geopolitical
tensions.

 

Ian Lankshear, CEO of EnSilica, commented:

 

"We're delighted to announce this significant agreement with one of Europe's
leading satellite operators focused on developing a specialist chip to be used
in a satellite payload, starting with a feasibility study. This custom chip is
intended to provide key differentiation to the satellite operator's services,
enhancing its market offering.

 

The satellite communications sector has had significant private and government
investments, driven in part by the current geopolitical instability, with
chips as integral components of technologies used for defence and government
purposes. EnSilica will continue to explore commercial opportunities across
this rapidly growing market."

 

For further information please contact:

 

 EnSilica plc                                                        via Vigo Consulting

 Ian Lankshear, Chief Executive Officer                              +44 (0)20 7390 0233

 Kristoff Rademan, Chief Financial Officer

 www.ensilica.com (http://www.ensilica.com/)

 Allenby Capital Limited, Nominated Adviser & Joint Broker           +44 (0)20 3328 5656

 Jeremy Porter / Vivek Bhardwaj (Corporate Finance)                  info@allenbycapital.com (mailto:info@allenbycapital.com)

 Joscelin Pinnington / Tony Quirke (Sales & Corporate Broking)

 Singer Capital Markets, Joint Broker

 Rick Thompson / Asha Chotai                                         +44 (0)20 7496 3000

 Vigo Consulting (Investor & Financial Public Relations)             +44 (0)20 7390 0233 ensilica@vigoconsulting.com

                                                                   (mailto:visum@vigoconsulting.com)
 Jeremy Garcia / Kendall Hill / Anna Stacey

 

The person responsible for arranging release of this announcement on behalf of
the Company is Ian Lankshear, Chief Executive Officer.

 

About EnSilica plc

 

EnSilica is a leading fabless design house focused on custom ASIC (Application
Specific Integrated Circuits) design and supply for OEMs and system houses, as
well as IC design services for companies with their own design teams. The
Company has world-class expertise in supplying custom RF, mmWave, mixed signal
and digital ICs to its international customers in the automotive, industrial,
healthcare and communications markets. EnSilica has a track record in
delivering high quality solutions to demanding industry standards.

 

The Company is headquartered near Oxford, UK and has design centres across
the UK and in Bangalore, India and Porto Alegre and Campinas,
Brazil.  

 

 

 

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