REG - Ethernity Networks - UEP2025 business progress

Ethernity NetworksAnnouncement

20/03/2023 07:00

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RNS Number : 4441T  Ethernity Networks Ltd  20 March 2023

20 March 2023

ETHERNITY NETWORKS LTD.

("Ethernity" or the "Company")

 

UEP2025 business progress

 

Ethernity Networks (AIM: ENET.L; OTCQB: ENETF), a leading supplier of data
processing semiconductor technology for networking appliances, is pleased to
provide an update on commercial progress with its UEP2025 bonding product.
 Following the official release of the Company's UEP2025 bonding product
during the recent WISPA Event detailed below, the Company is experiencing
further interest in the patented link bonding as follows:

 

Presentation at WISPA Event

 

Ethernity exhibited a live demo and presented a session on its link bonding
technology at the WISPAmerica event in Louisville, Kentucky USA between 7-9
March 2023. The Directors believe that the technology and the UEP2025 system
created excitement among the wireless internet service providers ("WISPs") by
providing the ability to dynamically distribute data along multiple wireless
links of the same or different speeds and technologies, overcoming lost
connections and degraded effective capacities that are the result of
environmental factors, as well as the ability to do so regardless of the radio
vendor.

 

As a next stage, the Company plans to supply the UEP2025 product to several
WISPs in the USA for initial product introduction into the WISP network during
Q2 2023, as a result of demand generated during the event. Following the
product introduction, the Company anticipates that the WISPs will be able to
expand the deployment of the product into the rest of their networks, which
could lead to larger orders for the UEP2025 bonding product. Further expansion
to the larger WISP community would then come through the Company's OEM
partners.

 

Existing Bonding OEM customer

 

On 17 January 2023, the Company announced that it had delivered a UEP2025 for
testing and integration with an existing prominent microwave wireless OEM
customer. The Company is now delivering additional, fully integrated UEP2025s
to the customer's sales and marketing teams to allow them to properly
introduce the UEP2025 bonding product to their large WISP-based customers, in
anticipation of orders for the product.

 

David Levi, CEO of Ethernity Networks, commented: "We have believed from the
outset that our patented link bonding technology has the potential to be a
game changer for the wireless industry, and with the release of the UEP2025
product with bonding support, software configuration and management software,
we believe that we are delivering a must-have offering for high-capacity
wireless delivery."

 

For further information, please contact:

 

 Ethernity Networks Ltd                                        Tel: +972 8 915 0392
 David Levi, Chief Executive Officer
 Mark Reichenberg, Chief Financial Officer

 Allenby Capital Limited (Nominated Adviser and Joint Broker)  Tel: +44 (0)20 3328 5656
 James Reeve / Piers Shimwell (Corporate Finance)

 Amrit Nahal (Sales and Corporate Broking)

 Peterhouse Capital Limited (Joint Broker)                     Tel: +44 (0)20 7562 0930
 Lucy Williams / Duncan Vasey / Eran Zucker

 Harbor Access Inc (US Investor Relations)                     Tel: +1 (475) 477 9401

 Jonathan Paterson

 

About Ethernity ( www.ethernitynet.com (http://www.ethernitynet.com/) )

Ethernity Networks (AIM: ENET.L OTCQB: ENETF) provides innovative,
comprehensive networking and security solutions on programmable hardware that
increase telco/cloud network infrastructure capacity. Ethernity's
semiconductor logic offers data processing functionality for different
networking applications, innovative patented wireless access technology, and
fibre access media controllers, all equipped with control software with a rich
set of networking features. Ethernity's solutions quickly adapt to customers'
changing needs, improving time-to-market, and facilitating the deployment of
5G over wireless and fibre infrastructure.

 

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