Brief: Foxconn Interconnect Technology Approves Proposal To Make Capital Injection Of $500 Mln
11/08/2023 10:48
Aug 11 (Reuters) - Foxconn Interconnect Technology Ltd
6088.HK :
* APPROVAL OF PROPOSAL TO MAKE CAPITAL INJECTION OF US$500
MILLION
TO FOXCONN INTERCONNECT TECHNOLOGY SINGAPORE
* APPROVAL OF FIT SINGAPORE'S PROPOSAL TO MAKE CAPITAL
INJECTION
OF US$100 MLN TO FU WING INTERCONNECT TECHNOLOGY
* APPROVAL OF FIT SINGAPORE TO MAKE CAPITAL INJECTION OF
US$400
MLN TO CHANG YI INTERCONNECT TECHNOLOGY (INDIA)
Source text for Eikon: ID:nHKS5ZB1jk
Further company coverage: 6088.HK
((Reuters.Briefs@thomsonreuters.com;))
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