Brief: Foxconn Interconnect Technology Says Co And FIT Singapore Entered Into Settlement Agreement
17/12/2021 11:44
Dec 17 (Reuters) - Foxconn Interconnect Technology Ltd
6088.HK :
* CO AND FIT SINGAPORE ENTERED INTO SETTLEMENT AGREEMENT
WITH
SHARP AND KANTATSU
* LITIGATION WOULD BE WITHDRAWN UNDER SETTLEMENT AGREEMENT
* CONSIDERATION FOR SETTLEMENT IS US$24 MILLION
* CO AND FIT SINGAPORE AGREED TO TRANSFER CERTAIN KANTATSU
SHARES
OF ABOUT 28.36% OF EQUITY INTEREST IN KANTATSU
Further company coverage: 6088.HK
(Reporting by Jaskiran Singh)
((Jaskiran.Singh@thomsonreuters.com;))
Recent news on Foxconn Interconnect Technology
See all newsFoxconn Interconnect's Saudi JV to start building Middle East factory in December (updated)
Foxconn Interconnect's JV to start building Middle East factory in December (updated)
Foxconn Interconnect joint venture to start building Middle East factory in December
Brief: Foxconn Interconnect Technology's Board Approves Co's Proposal To Inject Capital Into Foxconn Interconnect Technology Singapore
Brief: Foxconn Interconnect Technology Posts Qtrly Net Profit From Cont Ops $6.2 Million