Brief: Foxconn Interconnect Technology Says Co And FIT Singapore Entered Into Settlement Agreement
Dec 17 (Reuters) - Foxconn Interconnect Technology Ltd
6088.HK :
* CO AND FIT SINGAPORE ENTERED INTO SETTLEMENT AGREEMENT
WITH
SHARP AND KANTATSU
* LITIGATION WOULD BE WITHDRAWN UNDER SETTLEMENT AGREEMENT
* CONSIDERATION FOR SETTLEMENT IS US$24 MILLION
* CO AND FIT SINGAPORE AGREED TO TRANSFER CERTAIN KANTATSU
SHARES
OF ABOUT 28.36% OF EQUITY INTEREST IN KANTATSU
Further company coverage: 6088.HK
(Reporting by Jaskiran Singh)
((Jaskiran.Singh@thomsonreuters.com;))
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