GlobalFoundries to make key AI chip component for TSMC
GlobalFoundries to make key AI chip component for TSMC Oct 8 (Reuters) - GlobalFoundries GFS.O on Thursday said it would make a key component used to link AI processors and memory chips for TSMC 2330.TW at its New York facility.
Known as a silicon interposer, the component sits beneath processors and memory chips inside advanced AI packages and enables them to communicate at high speeds.
Under the five-year agreement, GlobalFoundries will expand manufacturing capacity at its Malta, New York, facility to produce the components for TSMC
The Malta facility is expected to become the first US-based source of silicon interposers used in advanced chip-packaging technologies, the company said
Shares of GlobalFoundries were up about 4% in premarket trading
The deal provides a framework for future capacity expansion as demand for advanced packaging grows, with volume production expected to begin ramping up in the first half of 2028
Advanced packaging has become a major constraint on AI chip production, as demand for the technology exceeds available manufacturing capacity
(Reporting by Prathik Jayaprakash in Bengaluru; Editing by Jonathan Ananda)
((Prathik.Jayaprakash@thomsonreuters.com; +91 9916364306))