Brief: Gold Circuit Electronics Plans To Raise Up To T$9 Bln Via Bond
04/09/2025 10:02
Sept 4 (Reuters) - Gold Circuit Electronics Ltd 2368.TW: PLANS TO RAISE UP TO T$9 BILLION ($293.2 MLN) VIA THIRD UNSECURED BOND ISSUE PROCEEDS FROM THE BOND SALE WOULD BE USED FOR VARIOUS PURPOSES INCLUDING PURCHASING REAL ESTATE, PLANT CONSTRUCTION, PAYING DOWN DEBT Source text: ID:nMOPb6brpN Further company coverage: 2368.TW (Reporting by Faith Hung) ((faith.hung@thomsonreuters.com;))
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