Brief: Hydoo International proposes placing of bonds
21/03/2016 13:20
March 21 (Reuters) - Hydoo International Holding Ltd 1396.HK : * Bonds in an aggregated principal amount of up to hk$200 million * Says company and the placing agent entered into the placing agreement * Source text for Eikon ID:nHKS892wfg ((For more news, please click here 1396.HK )) ((Bengaluru Newsroom; +91 80 6749 1130))
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