Brief: Hanmi Semiconductor Signs 1.6 Bln Won Contract To Provide Chip Manufacturing Equipment
01/04/2019 01:08
April 1 (Reuters) - Hanmi Semiconductor Co Ltd 042700.KS :
* SAYS SIGNS CONTRACT WORTH 1.6 BILLION WON ($1.41 million)
TO
PROVIDE CHIP MANUFACTURING EQUIPMENT TO MICRON SEMICONDUCTOR
ASIA OPERATIONS MSAP.UL
Source text for Eikon: https://bit.ly/2Fzr4AQ
Further company coverage: 042700.KS
($1 = 1,136.4500 won)
(Reporting by Yuna Park)
((Yuna.Park@thomsonreuters.com; Reuters Messaging:
yuna.park.thomsonreuters.com@reuters.net))
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