May 26 (Reuters) - Heiwa Real Estate REIT Inc 8966.T :
* Says the company will issue bonds for up to 100 billion
yen during the period from May 28, 2016 to May 27, 2018
* Says each bonds worth more than 100 million yen
* Says proceeds will be used to acquire properties, repay
loans and supply working capital
Source text in Japanese:https://goo.gl/KWHuVI
Further company coverage: 8966.T
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Keywords: HEIWA REIT/BRIEF