Brief: Heiwa Real Estate REIT to issue 3th series unsecured bonds worth 1 bln yen
26/04/2018 03:13
April 26 (Reuters) - Heiwa Real Estate REIT Inc 8966.T
* Says it will issue 3th series unsecured corporate bonds
worth 1
billion yen with coupon rate of 0.7 percent and maturity date on
May 2, 2028
* The bonds are each with face value of 100 million yen,
issue
price at 100 yen per face value of 100 yen
* Subscription date on April 26 and payment date on May 7
* SMBC Nikko Securities Inc., Daiwa Securities Co.Ltd. and
Mitsubishi UFJ Morgan Stanley Securities Co., Ltd. will serve as
underwriters
* The bonds will be used for loan repayment
Source text in Japanese:https://goo.gl/UHS43B
Further company coverage: 8966.T
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