Brief: Heiwa Real Estate REIT to issue REIT bonds worth 2.8 bln yen
23/06/2017 03:40
June 23 (Reuters) - Heiwa Real Estate REIT Inc 8966.T
* Says it will issue first series REIT bonds worth 1 billion
yen
* The bonds are each with face value of 100 million yen,
issue price at 100 yen per face value of 100 yen, maturity date
on June 30, 2022 and coupon rate 0.3 percent per annum
* Says it will issue second series REIT bonds worth 1.8
billion yen
* The bonds are each with face value of 100 million yen,
issue price at 100 yen per face value of 100 yen, maturity date
on June 30, 2027 and coupon rate 0.65 percent per annum
* Subscription date on June 23 and payment date on June 30
* Nomura Securities Co., Ltd., Mizuho Securities Co., Ltd.
,Daiwa Securities Co.Ltd. and SMBC Nikko Securities Inc. will
serve as underwriters
* Proceeds will be used for loan repayment
Source text in Japanese:https://goo.gl/1LBtbV
Further company coverage: 8966.T
(Beijing Headline News)
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