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    Brief: Qualcomm and Himax Technologies jointly announce high resolution 3D depth sensing solution

    Picture of Himax Technologies logoHimax Technologies
    30/08/2017 11:00
    Aug 30 (Reuters) - Himax Technologies Inc  HIMX.O  
    * Qualcomm and Himax Technologies jointly announce high 
resolution 3D depth sensing solution 
    * Qualcomm Inc - co and Himax will commercialize SLiM 3D 
camera as a total camera system solution with mass production 
targeting in Q1/2018 
 
Source text for Eikon:  ID:nPn8zZhh6a  
Further company coverage:  HIMX.O  
 
 ((Bangalore.newsroom@thomsonreuters.com; ;))

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