Brief: Hua Hong Semiconductor Announces Offer Size & Offer Price For Proposed RMB Share Issue
July 24 (Reuters) - Hua Hong Semiconductor Ltd
1347.HK :
* OFFER SIZE AND OFFER PRICE FOR PROPOSED RMB SHARE ISSUE
* WILL ISSUE 407.8 MILLION RMB SHARES AT OFFER PRICE OF
RMB52.00
PER RMB SHARE
Further company coverage: 1347.HK
((Reuters.Briefs@thomsonreuters.com;))
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