Brief: Hua Hong Semiconductor Signs Technology Development Agreement
Dec 1 (Reuters) - Hua Hong Semiconductor
688347.SS 1347.HK :
* SAYS IT SIGNS TECHNOLOGY DEVELOPMENT AGREEMENT, WITH
AMOUNT OF
110-180 MILLION YUAN ($15.41-25.21 million)
Source text
Further company coverage: 688347.SS
($1 = 7.1395 Chinese yuan renminbi)
(Reporting by Hong Kong newsroom)
((twinnie.siu@tr.com; 852-3462 7715;))
Recent news on Hua Hong Grace Semiconductor
See all newsChina's Hua Hong Grace Semiconductor rises as Q3 profit soars
Hua Hong Grace Semiconductor slips on investment in wafer producer
China stocks end higher on semiconductor and AI gains
China, HK stocks fall; chip gains fail to offset broader losses
Hong Kong stocks flat as chipmaking frenzy offsets Beijing capital control fears