Brief: Mindtell Technology Announces Lapse Of Placing Agreement
18/07/2023 14:47
July 18 (Reuters) - Mindtell Technology Ltd 8611.HK :
* LAPSE OF PLACING AGREEMENT
Further company coverage: 8611.HK
((Reuters.Briefs@thomsonreuters.com;))
Recent news on Jufeel International Holdings
See all newsBrief: Mindtell Technology Proposes Rights Issue
Brief: Mindtell Technology Announces Termination Of Rights Issue And Placing Agreement
Brief: Mindtell Technology To Raise Gross Proceeds Of Up To Hk$287.8 Million
Brief: Mindtell Technology Says Lyu Xingjian Appointed As Executive Director
Brief: Mindtell Technology To Issue Convertible Bonds Worth HK$28.6 Million