Brief: US Chip Firm KLA Signed MoU With India's Tamil Nadu Govt To Invest $400 Mln To Establish Global R&D Campus- Tamil Nadu Industries Minister
13/02/2026 11:21
Feb 13 (Reuters) - U.S. CHIP FIRM KLA SIGNED MOU WITH INDIA'S TAMIL NADU GOVERNMENT TO INVEST $400 MILLION TO ESTABLISH GLOBAL RESEARCH AND DEVELOPMENT CAMPUS- TAMIL NADU INDUSTRIES MINISTER Further company coverage: KLAC.O ((Reuters.Briefs@thomsonreuters.com;))
Recent news on KLA
See all newsChipmaking tool firm Nearfield Instruments raises $380 million at $1.6 billion valuation
U.S. STOCKS ON THE MOVE-Jabil, BWX Technologies, Micron
U.S. STOCKS ON THE MOVE-Jabil, BWX Technologies, Micron
U.S. STOCKS ON THE MOVE-Intel, La-Z-Boy, CME
Citi lifts PT on semiconductor equipment makers, shares rise