Brief: Kulicke & Soffa Expands Thermal Compression Bonding Capabilities To Accelerate Innovation In Integration Of Semiconductor And Silicon Photonics
01/02/2022 14:06
Feb 1 (Reuters) - Kulicke and Soffa Industries Inc KLIC.O :
* KULICKE & SOFFA EXPANDS THERMAL COMPRESSION BONDING
CAPABILITIES
TO ACCELERATE INNOVATION IN THE INTEGRATION OF SEMICONDUCTOR AND
SILICON PHOTONICS
Source text for Eikon: ID:nPn958R17a
Further company coverage: KLIC.O
((Reuters.Briefs@thomsonreuters.com;))
Recent news on Kulicke And Soffa Industries
See all newsKulicke and Soffa Industries Inc reports results for the quarter ended June 30 - Earnings Summary
Singapore's Kulicke and Soffa Q3 revenue more than doubles, beats estimates
Brief: Kulicke and Soffa Q3 Adjusted EPS USD 1.2
Kulicke and Soffa Industries Inc expected to post earnings of $1.01 a share - Earnings Preview
Kulicke and Soffa beats Q2 revenue, profit estimates on chip, auto markets demand