Brief: Nanya Technology Says Will Raise T$4 Billion Via Unsecured Bond Issue
March 29 (Reuters) - Nanya Technology Corp 2408.TW :
* SAYS WILL RAISE T$4 BILLION ($125 MLN) VIA UNSECURED BOND
ISSUE
FOR SUSTAINABLE DEVELOPMENT OF NEW 5A PLANT
* SAYS THE 5-YEAR BOND WOULD BE PRICED WITH A YIELD OF 1.75%
Source text for Eikon: ID:nMOP4ry0fz
Further company coverage: 2408.TW
(Reporting by Faith Hung)
((faith.hung@thomsonreuters.com;))
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