India's Paras Defence's semicon unit to set up $644 million chip packaging facility
India's Paras Defence's semicon unit to set up $644 million chip packaging facility July 22 (Reuters) - Indian defence engineering company Paras Defence and Space Technologies PRAF.NS said on Wednesday that its semiconductor unit would invest 62 billion rupees ($643.79 million) to set up a chip packaging and testing facility in the central Indian state of Madhya Pradesh.
Here are some details:
Paras Semiconductors, a subsidiary of the company, signed a memorandum of understanding with the Madhya Pradesh government's department of science and technology to jointly set up an outsourced semiconductor assembly and test (OSAT) facility in the Indore-Ujjain region.
An OSAT plant packages, assembles and tests foundry-made silicon wafers, turning them into finished semiconductor chips.
The facility will undertake advanced chip packaging operations and test the packaged chips for reliability, the company said.
($1 = 96.3050 Indian rupees)
(Reporting by Abhirami G in Bengaluru; Editing by Rashmi Aich)
((abhirami.g@thomsonreuters.com))
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India's Paras Defence's semicon unit to set up $644 million chip packaging facility
Brief: Paras Defence To Invest 62 Billion Rupees In IC Packaging OSAT Facility In Madhya Pradesh