Brief: Radium Life Tech to issue 1st series domestic unsecured private placement corporate bonds of T$2 bln

Radium Life Tech

01/07/2016 07:46

July 1 (Reuters) - Radium Life Tech  2547.TW : 
     
    * Says it will issue the 1st series domestic unsecured 
private placement corporate bonds, worth T$2 billion 
    * Says par value and issue price of T$1 million for the 
bonds 
    * Maturity period of three years for the bonds 
    * Proceeds to be used to enrich operating funds 
     
     
    Source text in Chinese: http://985.so/4ped 
    Further company coverage: 2547.TW  
 
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