Brief: Radium Life Tech to issue 2nd private placement domestic unsecured corporate bonds of T$2 bln

Radium Life Tech

18/07/2016 03:01

July 18 (Reuters) - Radium Life Tech  2547.TW : 
     
    * Says it will issue the 2nd private placement domestic 
unsecured corporate bonds of T$2 billion 
    * Says par value and issue price of T$1 million for the 
bonds 
    * Says the interest rate is 3 percent 
    * Maturity period of three years, from July 15, 2016 to July 
15, 2019 
    * Proceeds will be used to enrich operating funds 
     
     
    Source text in Chinese: http://985.so/5Tda 
    Further company coverage: 2547.TW  
 
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