Brief: Resideo Signs Agreement To Accelerate Payment Of All Potential Monetary Obligations
30/07/2025 12:40
July 30 (Reuters) - Honeywell International Inc HON.O: RESIDEO SIGNS AGREEMENT TO ACCELERATE PAYMENT OF ALL POTENTIAL MONETARY OBLIGATIONS UNDER INDEMNIFICATION AND REIMBURSEMENT AGREEMENT WITH HONEYWELL AND ELIMINATE ALL FUTURE PAYMENTS RESIDEO TECHNOLOGIES INC: UNDER TERMS OF DEAL, CO TO MAKE A ONE-TIME CASH PAYMENT OF $1.59 BILLION TO HONEYWELL IN Q3 OF 2025 RESIDEO TECHNOLOGIES: EXPECTS Q2 NET REVENUE, ADJUSTED EPS TO BE ABOVE HIGH-END OF ITS OUTLOOK RANGE PROVIDED ON MAY 6 RESIDEO TECHNOLOGIES: INTENDS TO SEPARATE ITS ADI GLOBAL DISTRIBUTION BUSINESS THROUGH A TAX-FREE SPIN-OFF TO CO'S SHAREHOLDERS Source text: ID:nPn5cHtCYa Further company coverage: HON.O ((Reuters.Briefs@thomsonreuters.com;))
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