Brief: Samsung Electro-Mechanics Plans To Invest 300 Billion Won In Flip Chip Ball Grid Array Infrastructure In S.Korea And Vietnam
June 22 (Reuters) - Samsung Electro-Mechanics Co Ltd
009150.KS :
* PLANS TO INVEST 300 BILLION WON ($232.14 million)IN FLIP
CHIP
BALL GRID ARRAY INFRASTRUCTURE IN S.KOREA AND VIETNAM
Further company coverage: 009150.KS
($1 = 1,292.3400 won)
(Reporting by ByungwookKim Kim)
((Byungwook.Kim@thomsonreuters.com;))
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