Sept 2 (Reuters) - Sekisui House Reit Inc 3309.T :
* Says it plans to issue REIT bonds worth 2 billion yen via
public offering
* Says interest rate at 0.34 percent
* Says maturity on Sep. 8, 2026
* Says subscription date on Sep. 2 and payment date on Sep.
8
* Says proceeds to be used to pay back loans
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