Brief: Shenwan Hongyuan HK Announces Issuance Of U.S.$200 Mln 1.5% Bonds Due 2023
21/01/2022 01:22
Jan 21 (Reuters) - Shenwan Hongyuan HK Ltd 0218.HK :
* ISSUANCE OF U.S.$200 MILLION 1.5% BONDS DUE 2023
Further company coverage: 0218.HK
((Reuters.Briefs@thomsonreuters.com;))
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