Brief: Shenwan Hongyuan HK Says Application Made To HK Stock Exchange For Listing$300 Mln 2.625% Guaranteed Bonds Due 2025
16/03/2022 15:13
March 16 (Reuters) - Shenwan Hongyuan HK Ltd 0218.HK :
* APPLICATION MADE TO STOCK EXCHANGE OF HK FOR LISTING OF
U.S.$300
MILLION 2.625% GUARANTEED BONDS DUE 2025
Source text for Eikon: ID:nHKS3rFnV3
Further company coverage: 0218.HK
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