Brief: Shin Hwa World To Issue Bonds Of Not More Than Hk$200.0 Million
11/11/2024 11:09
Nov 11 (Reuters) - Shin Hwa World Ltd 0582.HK :
* PROPOSED ISSUE OF BONDS OF NOT MORE THAN HK$200.0 MILLION
Further company coverage: 0582.HK
((Reuters.Briefs@thomsonreuters.com;))
Recent news on Shin Hwa World
See all newsBrief: Shin Hwa World Posts HY Loss Attributable Hk$68.3 Million
Brief: Shin Hwa World Expects 60%-75% Decrease In HY Consolidated Net Loss
Brief: Shin Hwa World Logs FY Revenue HK$966.9 Mln
Brief: Shin HWA World Expects 20%-35% Decrease In Consolidated Net Loss For FY2025
Brief: Shin HWA World H1 Net Income HKD -244.4 Million