SK Hynix says ships samples of 12-layer next-gen HBM4E chips to major customers
18/06/2026 24:30
SK Hynix says ships samples of 12-layer next-gen HBM4E chips to major customers SEOUL, June 18 (Reuters) - SK Hynix 000660.KS said on Thursday it has shipped samples of its 12-layer HBM4E memory chip to major customers, as the South Korean chipmaker seeks to strengthen its position in the fast-growing AI semiconductor market.
(Reporting by Joyce Lee
Editing by Ed Davies)((joyce.lee@tr.com;))
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