REG - Sondrel (Holdings) - Tapeout: ASIC controller for Smartphone camera

Sondrel (Holdings)Announcement

30/05/2023 07:15

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RNS Number : 8949A  Sondrel (Holdings) plc  30 May 2023

The information contained within this announcement is deemed by the Company to
constitute inside information as stipulated under the UK Market Abuse
Regulation

 

30th May 2023

 

Sondrel (Holdings) plc

("Sondrel", the "Company" and together with its subsidiaries the "Group")

 

Successful Key Milestone Completion - Tapeout of an ASIC controller for
Smartphone camera

 

Sondrel (Holdings) plc (AIM: SND), the fabless semiconductor business
providing turnkey services in the design and delivery of 'application specific
integrated circuits' ("ASICs") and 'system on chips' ("SoCs") for leading
global technology brands, is pleased to announce that it has successfully
taped out an ASIC design (the "Project") for a controller of a smartphone
camera.

 

With the design phase of the Project now finished and its tapeout completed,
the Company will progress with the new product introduction and prototyping
phases of the turnkey supply services being provided to the customer by
Sondrel, ahead of the product being released to production thereafter.

 

The Project design contract was awarded to the Company in late 2021 and was
fully funded by the Customer. Project production and supply are expected to
begin at the start of 2024.

 

Based on production volumes and product lifetime currently projected by the
Customer, revenues associated with the production and supply of the ASIC could
be worth in excess of US$50 million over five years.

 

Tapeout signals the completion of the design phase of an ASIC and the handover
of all data to the silicon foundry which is contracted to manufacture the
ASIC. This tapeout data is used to initiate the generation of photomasks by
the foundry, which are then used to produce prototype silicon wafers. These
wafers are then packaged and tested before delivery to the customer for
prototype assessment. Upon approval of the prototypes, further samples undergo
qualification and reliability testing before the product is released to
production.

 

Graham Curren, Chief Executive Officer of Sondrel, commented:

 

"I am pleased to announce this new tapeout, our third since our IPO in Q4 last
year. Passing this key milestone underpins Sondrel's position as a leading
ASIC supplier for advanced designs. The successful tapeout of this ASIC is a
clear validation of Sondrel's focussed business strategy, and our track record
of innovation excellence again delivering excellent results for our customers.

 

"This complex design was completed in close cooperation with our customer's
engineering and product marketing teams, and will open up new markets for our
customer.  We look forward to progressing with the new product introduction
and prototyping phases ahead of the product entering production in 2024.

 

''Our focus on end markets that are aligned with strong and enduring global
technology megatrends means that we have a good pipeline of design
opportunities for 2023 and I look forward to updating the market on these as
the year progresses.''

 

 

 

Ends

 

For further information:

 

 Sondrel (Holdings) plc                                        Via Buchanan
 Graham Curren, CEO                                            Tel: +44 (0) 20 7466 5000
 Joe Lopez, CFO

 Cenkos Securities plc                                         Tel: +44 (0)20 7397 8900
 Ben Jeynes / Katy Birkin / George Lawson - Corporate Finance
 Alex Pollen / Michael Johnson - Sales

 Buchanan Communications                                       Tel: +44 (0) 20 7466 5000
 Chris Lane                                                    sondrel@buchanan.uk.com

 Stephanie Whitmore
 Jack Devoy
 Abby Gilchrist

 

About Sondrel

Sondrel is a UK-based fabless semiconductor company specialising in high end,
complex digital Application Specific Integrated Circuits (ASICs) and System on
Chips (SOCs). It provides a full turnkey service in the design, prototyping,
testing, packaging and production of ASICs and SoCs.

 

The Company is one of only a few companies capable of designing and supplying
the higher-spec chips built on the most advanced semiconductor technologies,
selling into a range of hyper growth end markets such as high-performance
computing, automotive, artificial intelligence, VR/AR, video analytics, image
processing, mobile networking and data centres.  Sondrel designs have enabled
products by leading technology brands including Apple (iPhone), Sony
(PlayStation), Meta's (Oculus), Samsung, Google and Sony smartphones, JVC
(prosumer camcorders), Tesla and Mercedes-Benz cars.

 

Sondrel is well-established, with a 20-year track record of successful
delivery, supported by long standing ecosystem partnerships including Arm,
TSMC and Samsung. Headquartered in the UK, Sondrel has a global presence with
offices in UK, USA, China, India and Morocco.

 

For more information please visit: www.ir.sondrel.com
(http://www.ir.sondrel.com/) .

 

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