Brief: STMicroelectronics $1.5Bn Dual Tranche Convertible Bonds Books Covered On Full Deal Size, Says Bookrunner
BRIEF-STMicroelectronics $1.5Bn Dual Tranche Convertible Bonds Books Covered On Full Deal Size, Says Bookrunner June 16 (Reuters) - Bookrunner:
STMICROELECTRONICS $1.5BN DUAL TRANCHE CONVERTIBLE BONDS BOOKS COVERED ON FULL DEAL SIZE (INDICATED DEMAND EXCEEDS DEAL SIZE) - BOOKRUNNER
Further company coverage: STMPA.PA
((Reuters.Briefs@thomsonreuters.com;))
Recent news on STMicroelectronics
See all newsEuropean chip stocks fall as AI financing fears hit sentiment
European AI-exposed stocks fall after hot US inflation fuels global selloff
European AI-exposed stocks caught up in global rout
Chip stocks lead losses in Europe as AI selloff spreads
STMicroelectronics seeks one-year renewal for CEO Chery (updated)