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    Brief: STMicroelectronics Prices $1.5 Billion Dual-Tranche Offering Of New Convertible Bonds

    Picture of STMicroelectronics logoSTMicroelectronics
    16/06/2026 17:13
    BRIEF-STMicroelectronics Prices $1.5 Billion Dual-Tranche Offering Of New Convertible Bonds
    June 16 (Reuters) - STMicroelectronics NV STMPA.PA:
    • STMICROELECTRONICS PRICES A US$1.5 BILLION DUAL-TRANCHE OFFERING OF NEW CONVERTIBLE BONDS
    • ISSUES TWO TRANCHES: US$750 MILLION DUE 2031, US$750 MILLION DUE 2033
    • SETTLEMENT OF NEW CONVERTIBLE BONDS EXPECTED ON JUNE 23, 2026
    • PROCEEDS TO FUND GENERAL PURPOSES AND EARLY REDEMPTION OF US$750 MILLION 2027 BONDS
    Source text: ID:nGNE651lKs
    Further company coverage: STMPA.PA

     (Gdansk Newsroom)
     ((gdansk.newsroom@thomsonreuters.com; +48 58 769 66 00;))

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