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    STM — STMicroelectronics NV News Story

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    Brief: STMicroelectronics Announces $1.5 Bln Dual-Tranche Offering Of New Convertible Bonds, Early Redemption Of 2027 Convertible Bonds

    Picture of STMicroelectronics NV logoSTMicroelectronics NV
    16/06/2026 06:47
    BRIEF-STMicroelectronics Announces $1.5 Bln Dual-Tranche Offering Of New Convertible Bonds, Early Redemption Of 2027 Convertible Bonds
    June 16 (Reuters) - STMicroelectronics NV STMPA.PA:
    • STMICROELECTRONICS ANNOUNCES (I) A US$1.5 BILLION DUAL-TRANCHE OFFERING OF NEW CONVERTIBLE BONDS AND (II) THE EARLY REDEMPTION OF ITS 2027 CONVERTIBLE BONDS
    • 2031 CONVERTIBLE BONDS BEAR INTEREST BETWEEN 0% AND 0.5%
    • 2033 CONVERTIBLE BONDS BEAR INTEREST BETWEEN 0.63% AND 1.13%
    • NEW CONVERTIBLE BONDS IN TWO TRANCHES, MATURING IN 2031 AND 2033
    • NEW CONVERTIBLE BONDS TO BE ADMITTED TO TRADING ON FRANKFURT STOCK EXCHANGE
    • INITIAL CONVERSION PRICE PREMIUM FOR 2031 BONDS 47.5%-52.5%, 2033 BONDS 50%-55%
    • 2027 CONVERTIBLE BOND HOLDERS MAY CONVERT AT $45.1 PER SHARE UNTIL JULY 1, 2026
    • OFFERING PROCEEDS, NET OF COSTS, WILL BE USED FOR GENERAL CORPORATE PURPOSES, INCLUDING EARLY REDEMPTION OF 2027 CONVERTIBLE BONDS
    Source text: ID:nGNE2qMhtr
    Further company coverage: STMPA.PA

     (Gdansk Newsroom)
     ((gdansk.newsroom@thomsonreuters.com; +48 58 7696600;))

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